Streamlining HDI PCB Design Through Outsourcing & Co-Design

High-Density Interconnect (HDI) printed circuit boards (PCBs) have become a vital element of various fields like a smartphone, and medical devices. The small size of their layouts, thin lines, and development of layers have made it possible for the manufacturers to put more power into less space. But the process of making HDI boards is a complicated one. To appropriately handle signal integrity, blind/buried vias, and miniaturization requires the skills of a professional and the accuracy of an executor. That is the reason why many companies decide to use PCB design services and co-design models to lessen the risks, save more time, and get their products to market quicker.

In this blog, we are going to look at how outsourcing and co-design simplify HDI PCB design, the difficulties that companies encounter and the reasons a partner can make a difference.

The Complexity of HDI PCB Design

HDI designs are not your regular PCBs, in which the microvias, stacked layers, and high pin-count components are used. Basically, these requirements confuse everything from routing strategies to manufacturing tolerances.

Some common challenges include:

• Signal integrity issues: The high-speed signals that go through the dense traces are more susceptible to crosstalk and impedance mismatches.
  
  
• Manufacturing constraints: The laser-drilled microvias, stacked vias, or sequential lamination can be only handled by a limited number of fabricators.
  
  
• Thermal management: So many components in such a small footprint are like a fire waiting to happen, thus overheating becomes a serious risk.
  
  
• Higher NRE costs: One mistake in HDI design most of the time results in a costly re-spin that product launch is delayed.

If in-house teams do not have advanced tools or HDI experience, these challenges could slow down the process of innovation significantly. The outsourcing acts as a bridge to overcome this gap.

Why is Outsourcing HDI PCB Design better?

Outsourcing is a process by which the tasks of challenging and complicated designs are handed over to professional engineers who are experts in PCB matters. The benefits include:

• Access to knowledge: The external groups have deep knowledge of HDI-specific routing, via structures and stack-up optimization.
  
  
• Lower risk of rework: The designs are checked for compatibility with fabrication capabilities before a prototype is made, thus the failure of the board is less likely.
  
  
• Shorter turnaround: The EDA tools and simulation platforms that the outsourcing partners use are always at the cutting edge of technology, hence they have easy access to them.
  
  
• Cost-effectiveness: Companies can instead of hiring specialists full-time, use a number of resources that fit their needs.

Outsourcing is, for the most part, not about taking shortcuts in the case of product companies but rather about accessing a level of expertise that guarantees success on the first try.

The Power of Co-Design in HDI

Although outsourcing offers the necessary expertise, co-design guarantees the collaboration. In co-design the employees of the client and the outsourced design team work together from the very beginning. This model offers:

• Setting the functional requirements at the very beginning: Stakeholders get on the same page about design objectives, layer counts and material choices before layout starts.

• Working together simultaneously: The mechanical, electrical, and thermal teams can interact instantly to solve the potential conflicts.

• More straightforward production: Just by having the producers in the co-design loop, the designers are allowed to alter designs to be in line with the real production capabilities.

• Reduced change volume: The involvement of the feedback loop throughout the design process reduces the likelihood of the last-minute changes to the design.

Such a joint method not only speeds up the decision-making process but also becomes a guarantee that the resulting board is innovative and manufacturable.

Key Strategies for Streamlined HDI Design

• Define stack-up early: Determine the number of layers, via structures and materials in the initial phase to have a clear routing plan.
  
  
• Use advanced EDA tools: Such as OrCAD or Allegro can be extremely helpful in working with dense designs, setting up design rules and simulating the performance of high-speed signals.
  
  
• Incorporate DFM checks: Design-for-Manufacturing (DFM) inspections done regularly ensure that layouts which cannot be produced, or are too expensive to be produced, are not designed.
  
  
• Give thermal analysis a top spot: Thermal simulation at the early stages prevents issues of reliability when the board is put together and in use.
  
  
• Work with fabricators: Get manufacturers on board during the design phase rather than after, thus making sure that trace widths, via sizes and tolerances are well within production limits.

By implementing these measures along with outsourcing and co-design their successful attempts of fabricating the robust HDI PCB will go up significantly.

Sunstream’s Approach to HDI PCB Outsourcing and Co-Design

At Sunstream Global we are not only the implementers of the design you provide but also, in fact, the extended part of your engineering team. We combine the efforts of our highly qualified specialists who bring to the table an advanced EDA platform, a tested HDI design approach, and a few years of expertise in successful HDI design projects. With these, we can satisfy the requirements that the customer sets for the product with respect to its functionality, reliability and standards conformity.

We place great emphasis on working in a collaborative manner with our clients to ensure that there is an understanding right from the beginning. Through the use of best practices and our years of high density PCB layout services expertise, we assist organizations in creating boards that not only have the capacity to function as envisaged but also comply with different global regulations.

By choosing Sunstream to outsource and co-design, you will enjoy the benefits of accelerated prototyping, minimized rework and products that have been optimized for your manufacturing process.