How To Use OrCAD X For PCB Layout Planning?

The Printed Circuit Board or PCB layout planning is one of the crucial steps in electronic design as it ensures the signal integrity, thermal managements, and manufacturability. The OrCAD X is one of the powerful suites that offers a streamlined process for PCB layout making the entire process easier for engineers and designers to create reliable circuit boards. Hence, this blog from Sunstream explains how to use OrCAD X for PCB layout planning.

PCB Layout Planning Considerations:

It is essential to look for the necessary PCB layout planning considerations before knowing how to use OrCAD X for PCB layout planning. They are

BOM Validation

The foremost thing to consider during the PCB layout planning considerations is the BOM validation. It is essential to verify the manufacturer part number or MPN and vendor part numbers or VPN. So, by checking these you can ensure the component availability while avoiding the long lead times or obsolete parts. Also, mark Do Not Install or DNI components appropriately in the BOM.

Stack-Up Design

Secondly, it is essential to consider the stack-up design for the PCB planning considerations. It is essential to select the right materials based on the environmental and frequency needs. Also, it is important to define the number of layers for power, ground planes, and signal for effective PCB layout planning. In addition, it is important to establish a controlled impedance and choose the right copper thickness for the stack-up design.

Design Rule Definition

Thirdly, the design rule definition should be considered before PCB planning layout. So, it is important to set the right electrical rules for impedance, high-frequency designs, and resistance. Also, it is essential to define the physical rules for the clearances, trace widths, and pathway widths. Finally, there needs to be specification on spacing rules for copper-to-edge distances, pathways, and traces.

Schematic & Netlist Preparation

Another important aspect of PCB planning consideration is the schematic & netlist preparation. So, for this you need to consider the creation of component symbols with references linked to the footprints. Also, it is important to ensure the netlists clearly define the connections and the crucial signal pathways. Finally, it is important to mark the power nets and impedance-controlled traces for easy identification. 

Board Outline Definition

It is crucial to consider the board outline definition with defined dimensions and shape which can be done by importing the CAD data or manually. The defined dimension should align with enclosure designs and various other constraints. Also, there should be enough edge clearances for components and traces. 

DFM Considerations

Finally, the DFM consideration is essential to maintain the minimum trace widths and spacing as per the fabrication guidelines. At this point you need to avoid the complex assembly features including the via-in-pad unless they are important. In addition, ensure the  solder and silkscreen mask layers are clear and legible.

OrCAD X For PCB Layout Planning

BOM Validation

You can use the Live BOM in the OrCAD X, a PCB layout planning element, to design the data with the real-time component availability. Also with this PCB editor you can validate the MPN, VPN, and mark the components of DNI directly. 

Stack-Up Design

The OrCAD X Editor has the cross-section of a PCB layout planning element which helps in defining and visualizing the PCB stack-up like material properties, layer count, and thickness. Also, with this editor you can incorporate the controlled impedance and visualize the copper thicknesses. In addition, you can assign the power and ground layers during the stack-up definition.

Design Rule Definition

With OrCAD Editor you can simply set the spacing, physical, and electrical rules with the help of constraint manager covering the via -sizes, trace widths, and impedance. You can also define the advanced constraints and use the DRC validation tool to ensure the compliance with IPC standards. 

Footprint Management

OrCAD X’s Footprint Editor’s wizard helps you to create and verify the footprints based on the IPC guidelines and datasheets. Also, you can manage the component-to-component and pad-to-pad spacing to avoid the solder bridging. You can also validate the footprint alignment using the integrated 3D Viewer Tool and incorporate the pin1 and polarity indicators to avod the errors during the assembly process. 

Board Outline Definition

With OrCAD X’s Mechanical Layer Editor you can define the outline of the board. Also, you can import the mechanical constraints through DXF/DWG files.

So using the OrCAD X for the PCB planning you can ensure there is a robust and optimized design process enhancing the design accuracy and reducing the production costs. Sunstream is your right partner for Cadence tool needs. Approach Sunstream for right PCB design services for efficient and error free, manufacturable PCBs tailored to your project needs.