know how orcad x helps minimizes the common pcb failures

Know How OrCAD X Helps Minimizes The Common PCB Failures

The PCBs are an essential part in any electronic system. It is important to understand that these PCBs can experience failure due to various reasons. With the introduction of OrCAD X the ideal PCB design tool revolutionized the PCBs designing process through their exceptional features to reduce the PCB failure. Through this advanced application, the engineers can address their design challenges effectively and earlier before they arise. Hence, this blog will explore how OrCAD X helps minimize the common PCB failures allowed and below mentioned are the common potential failures that arise in the PCB circuit.

The Common Failures In PCB Circuits:

Component Failures

The foremost failure in the PCB circuit is the component failure which often fails due to low quality, external stress like humidity and temperature, or inappropriate specifications. In addition, the usage of counterfeit components, low quality components, and reduced board thickness. 

Faulty Traces

Another common issue in the PCBs is the faulty traces which are often damaged physically due to corrosion. In addition, the traces also get damaged due to design flaws. Hence, these concerns can often lead to breakage and overheating resulting in PCB failure.

Power Failures

Thirdly, power disruptions are also the common cause for the PCB failure. The common problem of power failures are the insufficient supply of voltage and damages in the  power distributing components. These disruptions can lead to uneven distribution of power and damaged power components leading to power failure. 

Design Errors

The design errors in the PCB can also lead to PCB failures. The inappropriate placement of components, insufficient spacing between the components for the thermal expansion, or the errors in the schematic PCB design. In addition, the trace placed closely, cold joints, bad soldering, and poor connectivity are common design flaws that lead to PCB failure.

Plating Voids

The plating voids are the gaps which are seen over the plated copper coating of the PCB boards. These voids can be contaminated with dirt, debris, or air bubbles due to insufficient cleaning preventing the current to pass through. Also, it is to be noted that these voids are created during the manufacturing process but with additional care they can be prevented.

There are many PCB failures like insufficient copper-to-edge clearance, bad soldering, electromagnetic & thermal issues, environmental factors, and many more.

How OrCAD X Helps Minimizes The Common PCB Failures?

Increases Reliability:

The OrCAD X tool reduces the risk of component placement in the PCB designs through its component sourcing and Live BOM features. Through these features, designers can get real-time visibility, compliance, and the availability of the components. Also, users can also get complete insights on the component details, like compliance, risk scores, and manufactured numbers which greatly helps in selecting the right components meeting the industry standards and reduces the chances of PCB failures. 

Moreover, the OrCAD X tool also suggests alternate components for the high-risk electronic components, ensuring the placed components maintain the reliability and integrity of the design.

Prevent Faulty Traces:

The OrCAD X helps in preventing the faulty traces with the real-time Design Rule Checks (DRCs). This platform offers constraint-driven routing enabling the traces to be well-designed with enough spacing and reducing the risk of breakage and overheating. This tool is integrated with DRC which also helps in monitoring the complete PCB design by highlighting the potential risks. 

Minimizing Design Errors:

The OrCAD X tool helps in minimizing the design errors as it is integrated with the layout environment and schematic capture features. These features also offer real-time insights on the constraint management and feedback enabling the designers to find the highly potential risks in the design phase. It also offers features like accurate schematic entry and adequate spacing for enhanced optimization in the PCB design. 

Similarly, there are many other features offered by OrCAD X such as power-aware routing and power distribution network (PDN) analysis, Design for Fabrication (DFF) checks, constraint management tools, and thermal management features for a more reliable and efficient PCB process design.

OrCAD X is a game-changer in the PCB design landscape and Sunstream offers effective PCB layout services that navigate the complexities of PCB design and achieve your project goals with confidence.